Infineon IRFR3910TRLPBF: Key Specifications and Application Circuit Design Considerations

Release date:2025-11-10 Number of clicks:166

Infineon IRFR3910TRLPBF: Key Specifications and Application Circuit Design Considerations

The Infineon IRFR3910TRLPBF is a robust N-channel power MOSFET engineered with advanced silicon technology, making it a preferred choice for a wide array of power management and switching applications. Its combination of low on-state resistance, high current handling, and a compact D-Pak (TO-252) package offers designers an efficient solution for space-constrained and thermally challenging designs.

Key Electrical Specifications

A thorough understanding of the device's absolute maximum ratings and electrical characteristics is paramount for reliable circuit design.

Drain-Source Voltage (VDS): This MOSFET is rated for a maximum of 100V, categorizing it as suitable for applications like 48V telecom systems, industrial power supplies, and automotive non-critical loads.

Continuous Drain Current (ID): It can handle a continuous DC current of 5.6A at a case temperature (TC) of 25°C. This rating decreases as the ambient temperature rises, necessitating proper thermal management for high-current applications.

On-Resistance (RDS(on)): A standout feature is its exceptionally low typical on-resistance of 23mΩ (measured at VGS = 10V, ID = 2.8A). This low RDS(on) is the primary contributor to high efficiency, as it minimizes conduction losses and reduces heat generation during the on-state.

Gate-Source Voltage (VGS): The gate is sensitive and must be driven with a voltage within the ±20V limit. Exceeding this can instantly damage the oxide layer. The device is logic-level compatible, with a maximum threshold voltage (VGS(th)) of 2.35V, ensuring it can be easily driven by 3.3V or 5V microcontrollers.

Total Gate Charge (Qg): With a typical total gate charge of 11nC, the IRFR3910 offers fast switching capabilities. A lower Qg simplifies drive circuit design by reducing the current required from the gate driver IC to achieve quick turn-on and turn-off.

Critical Application Circuit Design Considerations

To fully leverage the performance of the IRFR3910TRLPBF, several design aspects must be carefully addressed.

1. Gate Driving: While the MOSFET is logic-level compatible, for switching frequencies above a few kHz, a dedicated gate driver IC is highly recommended. A driver provides the necessary peak current to rapidly charge and discharge the gate capacitance, minimizing transition time through the linear region and thus reducing switching losses. A small series resistor (e.g., 10-100Ω) between the driver and the gate (RG) is essential to dampen parasitic oscillations and control the switching speed, mitigating EMI.

2. Thermal Management: Despite its low RDS(on), power dissipation (I2 R) generates heat. The D-Pak package is designed to be mounted on a PCB copper pad acting as a heatsink. The size of this copper area (often defined in the datasheet) directly impacts the junction-to-ambient thermal resistance (RJA). For high-power scenarios, additional cooling via a dedicated heatsink attached to the tab is crucial to keep the junction temperature (TJ) well below the maximum rating of 175°C.

3. Protection Circuits:

Overvoltage/Transient Protection: Voltage spikes from inductive loads (e.g., motors, solenoids) can exceed the 100V VDS rating. A snubber circuit or a transient voltage suppression (TVS) diode should be used across the drain and source to clamp these spikes.

Overcurrent Protection: The circuit should incorporate fuses, current sense resistors, or dedicated ICs to protect the MOSFET from short-circuit conditions that could cause catastrophic failure due to excessive current.

4. Layout Best Practices: A poor PCB layout can introduce parasitic inductance and capacitance, leading to noise, ringing, and instability. Key practices include:

Minimizing high-current loop areas (especially the power path from source to drain) to reduce parasitic inductance.

Placing the gate driver IC as close as possible to the MOSFET gate pin.

Using generous power and ground planes to aid in heat dissipation and provide stable references.

ICGOODFIND

The Infineon IRFR3910TRLPBF is a highly efficient and versatile power MOSFET. Its low on-resistance and logic-level gate make it an excellent candidate for DC-DC converters, motor control, PWM applications, and load switching. Success hinges not just on selecting the right component but on meticulous attention to gate driving, thermal management, and PCB layout to ensure robust and reliable long-term operation.

Keywords:

Power MOSFET

Low On-Resistance

Logic-Level Gate

Thermal Management

Gate Driver Circuit

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